TLP185 Optocoupler SMD 4-Pin SOIC High Density Photocoupler

TLP185 Optocoupler SMD 4-Pin SOIC High Density Photocoupler

The Toshiba TLP185 Optocoupler is a 4-pin SOIC surface mount device. It provides signal isolation for electronic applications. This photocoupler separates circuits with different potentials and impedances. It facilitates data transmission between isolated circuits. The TLP185 features a transistor output. It has a 3750 Vrms isolation voltage. A maximum current transfer ratio of 300% is specified. The compact SMD package is suitable for designs requiring small footprints.

Specifications:

• Brand: Toshiba
• Mounting Type: Surface Mount
• Output Device: Transistor
• Number of Pins: 4
• Package Type: SOIC
• Input Current Type: DC
• Isolation Voltage: 3750 Vrms
• Maximum Current Transfer Ratio: 300%
• Maximum Forward Voltage: 1.4V
• Maximum Input Current: 10 mA
• Typical Rise Time: 5µs
• Typical Fall Time: 9µs

Key features and benefits:

• Photocoupler with transistor output
• 4-pin SOIC Surface Mount Device (SMD) package
• Isolation voltage of 3750 Vrms
• Current Transfer Ratio (CTR) up to 300%
• Switching performance: 5µs typical rise time
• Signal transmission between isolated circuits
• Toshiba brand component

Applications:

• Computer terminals
• System appliances and measuring instruments
• Registers, copiers, and automatic vending machines
• Signal transmission between circuits of different potentials and impedances

Frequently Asked Questions:

Q: What is the pinout configuration for the TLP185?
A: The TLP185 is a 4-pin SOIC device. Refer to the official Toshiba datasheet for specific pin assignments and package dimensions.

Q: Can the TLP185 replace other 4-pin SOIC optocouplers?
A: Compatibility depends on matching electrical specifications such as isolation voltage, current transfer ratio (CTR), and package dimensions. Compare datasheets for direct replacement.

Q: What is the typical forward current required for the input LED?
A: The maximum input current specified for the TLP185 is 10 mA.

Q: Is this component suitable for through-hole mounting?
A: No, the TLP185 is a Surface Mount Device (SMD) in a SOIC package, designed for surface mount assembly.

Package Includes:

*Image shown is a representation only.

Note: Contact sales(at)electroncomponents.com for bulk enquiry & get best price!