TLP185 Optocoupler SMD 4-Pin SOIC High Density Photocoupler

Toshiba TLP185 Optocoupler SMD: 4-Pin SOIC High Density Photocoupler

The Toshiba TLP185 Optocoupler is a high-performance, 4-pin SOIC surface mount device designed for robust signal isolation. This high-density photocoupler effectively separates circuits with different potentials and impedances, ensuring reliable data transmission. Featuring a transistor output, it provides excellent switching characteristics for various electronic applications. With an impressive 3750 Vrms isolation voltage and a maximum current transfer ratio of 300%, the TLP185 offers superior electrical insulation. Its compact SMD package makes it ideal for space-constrained designs. Trust Toshiba's quality for critical isolation needs in your projects.

Specifications:

• Brand/Make: Toshiba
• Mounting Type: Surface Mount
• Output Device: Transistor
• Maximum Forward Voltage: 1.4V
• Number of Channels: 1
• Number of Pins: 4
• Package Type: SOIC
• Input Current Type: DC
• Typical Rise Time: 5µs
• Maximum Input Current: 10 mA
• Isolation Voltage: 3750 Vrms
• Maximum Current Transfer Ratio: 300%
• Typical Fall Time: 9µs

Key features and benefits:

• High-density photocoupler with transistor output
• Compact 4-pin SOIC Surface Mount Device (SMD) package
• Exceptional isolation voltage of 3750 Vrms
• High Current Transfer Ratio (CTR) up to 300%
• Fast switching performance with 5µs typical rise time
• Reliable signal transmission between isolated circuits
• Manufactured by Toshiba for assured quality

Applications:

• Computer terminals
• System appliances, measuring instruments
• Registers, copiers, automatic vending machines
• Signal transmission between circuits of different potentials and impedances

Package Includes:

*Image shown is a representation only.

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