RELIFE Solder paste with TIN for SMT RL-401 SMD Solder flux NO-CLEAN 183°C SOLDERING PASTE

RELIFE RL-401 Solder Paste Sn63/Pb37 183°C No-Clean for SMT/SMD

RELIFE RL-401 Solder Paste is formulated for Surface Mount Technology (SMT) and Surface Mount Device (SMD) soldering. It contains a Sn63/Pb37 alloy with a melting point of 183°C. The no-clean formula minimizes post-soldering residue. This paste is compatible with reflow ovens and hot air soldering stations, providing wetting for component joints. It is packaged in a small container. Sealed containers maintain a shelf life of up to 6 months. Opened containers require refrigeration in a sealed pouch for quality preservation. This product is an alternative to solder wire for intricate SMD applications.

Specifications:

• Brand: RELIFE
• Model: RL-401
• Alloy Composition: Sn63/Pb37
• Melting Point: 183°C
• Particle Size: 20-38um
• Residue Type: Less residual
• Cleaning Required: No Clean
• Weight (approx.): 30gms
• Country of Origin: Hongkong

Key features and benefits:

• No-Clean formula for minimal residue
• Sn63/Pb37 alloy with a 183°C melting point
• Formulated for SMT and SMD component soldering
• Compatible with reflow ovens and hot air soldering stations
• Particle size range of 20-38um
• Provides wetting properties for solder joints
• Shelf life of 6 months when sealed

Applications:

• Soldering small SMD components
• Electronics prototyping
• Circuit board repair
• Reflow oven applications
• Hot air soldering station applications

Frequently Asked Questions:

Q: Does the RELIFE RL-401 solder paste require post-soldering cleanup?
A: No, the RELIFE RL-401 solder paste features a no-clean formula, minimizing residue and eliminating the need for post-soldering cleanup.

Q: What is the recommended storage for RELIFE RL-401 solder paste?
A: Sealed containers have a shelf life of up to 6 months. Opened containers should be stored tightly sealed in a plastic zipper pouch in the refrigerator.

Package Includes:

*Image shown is a representation only.

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