Heat Sink Compound (Anabond -652-C) - 50gms

Anabond 652-C Heat Sink Compound - 50gms for Optimal Thermal Management

The Anabond 652-C Heat Sink Compound is a high-performance, single-component modified silicone system. It is specifically designed for critical thermal management in various electronic applications. This specialized paste significantly improves heat transfer between components and heat sinks. It effectively fills even the most minute air gaps, drastically reducing thermal impedance. The compound ensures optimal operating temperatures for sensitive devices. It is thermally conductive yet electrically insulating, offering both safety and efficiency. Its robust formulation prevents hardening, drying, or melting, even after extended exposure to high temperatures up to 200°C. Trust Anabond 652-C for reliable and long-lasting thermal conductivity.

Specifications:

• Manufacturer: Anabond
• Grade: 652-C
• Weight: 50gms
• Color & Appearance: Milky White / Smooth Paste free from Particles
• Viscosity (cPs): 5,200,000 to 6,200,000
• Weight loss at 200 °C for 24 Hrs. (%): 4 - 8
• Country of Origin: India
• System Type: Single component modified silicone

Key features and benefits:

• Suitable for all types of transistors and semiconductor devices.
• Provides excellent heat dissipation characteristics.
• Effectively fills minute air gaps to reduce thermal impedance.
• Thermally conductive yet electrically insulating system.
• Resists hardening, drying, or melting even after prolonged exposure to 200°C.
• Single-component modified silicone system for easy application.

Applications:

• Mounting studs of transistors for effective heat sealing.
• Improving thermal conductivity at diode junctions.
• Enhancing heat transfer for silicone rectifiers.
• General heat sink applications in power electronics and e-accessories.
• Optimizing thermal performance of MOSFETs.

Package Includes:

*Image shown is a representation only.

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