Heat Sink PI48-50mm [TO220]

Heat Sink PI48-50mm TO-220 Black Anodized

The Heat Sink PI48-50mm is a thermal management component. It is designed for TO-220 package integrated circuits. This black anodized heat sink dissipates excess heat from components such as voltage regulators, MOSFETs, and motor drivers. Heat dissipation maintains operating temperatures. This process improves circuit efficiency and component reliability. It extends the operational lifespan of electronic parts. The aluminum alloy construction provides stable performance. Integration of this heat sink supports long-term stability in electronic systems.

Specifications:

• Model: PI48
• Compatibility: TO-220 Package ICs
• Length: 50mm
• Color: Black
• Material: Aluminum Alloy
• Surface Finish: Black Anodized
• Typical Components: Voltage Regulators, MOSFETs, Motor Drivers

Key features and benefits:

• Designed for TO-220 package integrated circuits.
• Provides heat dissipation.
• Black anodized finish for thermal emissivity and corrosion resistance.
• Length: 50mm.
• Constructed from aluminum alloy.
• Supports component reliability and operational lifespan.
• Mitigates thermal throttling.

Applications:

• Voltage Regulators (e.g., 7805, LM317).
• MOSFETs and Transistors in power switching applications.
• Motor Driver ICs for robotics and automation.
• Power Supply Units and DC-DC Converters.
• Audio Amplifier Circuits.

Frequently Asked Questions:

Q: How is this heat sink mounted to a TO-220 component?
A: Mounting involves a thermal compound and a mechanical fastener (e.g., screw, clip) through the TO-220 package's mounting hole and the heat sink's corresponding hole.

Q: Is this heat sink compatible with non-TO-220 packages?
A: The PI48-50mm is designed for TO-220 package integrated circuits. Compatibility with other packages is not guaranteed without modification.

Q: What are the thermal properties of the black anodized finish?
A: The black anodized finish enhances thermal emissivity, improving heat radiation. It also provides corrosion resistance.

Q: What thermal interface material is recommended for this heat sink?
A: A thermal interface material such as thermal paste or a thermal pad is recommended between the component and the heat sink to maximize thermal transfer efficiency.

Package Includes:

*Image shown is a representation only.

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